Parts for semiconductor manufacturing equipment
Shortest half-day estimate / Numerous achievements in the production of semiconductor-related parts! Procurement is possible from just one part! *[Video available now]*
In semiconductor-related equipment, we handle wire bonding (bonding) machines, forming machines and dedicated jigs, molding machines, laser markers, X-ray inspection equipment, sputtering equipment, etching equipment, etc. We can procure a variety of precision machined parts necessary for semiconductor manufacturing equipment, starting from just one piece. ◎ Unique Strengths - We have over 3,420 trading partners! We have numerous transactions with semiconductor manufacturers! - We accommodate small quantities of various types, starting from one drawing and one part. We support diverse machining technologies such as machining centers, lathes, sheet metal, resin cutting, and wire discharge. - Our unique procurement system streamlines procurement operations. Multiple necessary communications for each supplier are consolidated into one! → Our extensive processing technology and cultivated network make this possible. - We have our own inspection facilities covering 350 square meters! Using three-dimensional measuring machines and image dimension measuring devices, our inspection technicians conduct thorough inspections. → We deliver products guaranteed for quality through precise dimension measurement. Our machining parts achievements are featured in the catalog "100 Machined Parts," which includes semiconductor components! We can handle everything from metals to resins! Trust us with the cutting and processing of prototype and development parts.
- Company: エージェンシーアシスト 京都本社 営業所(仙台・東京・埼玉・神奈川・浜松・愛知・岐阜・新潟・福井・奈良・兵庫・岡山・福岡)
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